Wafer Bonder — TORCH510
Wafer Bonder — TORCH510
Wafer Bonder — TORCH510
Wafer Bonder — TORCH510
Wafer Bonder — TORCH510
Wafer Bonder — TORCH510
Wafer Bonder — TORCH510
Wafer Bonder — TORCH510
Wafer Bonder — TORCH510
Wafer Bonder — TORCH510
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Essential details
Shipping:Express Delivery
Product Introduction
1. Bonding area2-6inch
2. Mechanical pressure10T (56T, 100T are optional)
3. Bonding force2inch: max 50Mpa, 3inch max 22Mpa, 4inch max 12Mpa, 5inch max 8Mpa,  6inch max 5.5Mpa
4. Vacuum3Pa, working vacuum 10-200Pa, molecular pump 10-4Pa
5. Max temperature320℃
6. Temperature uniformity≤±1%
7. Heating rate20-60℃/min
8. Cooling rate10-30℃/min
9. Cooling wayWater cooling + nitrogen cooling
10. Post-Sintering Shear Strength25-35Mpa
11. Feeding wayManual
12. Voltage380V, 25-50A
13. Size1000*80*2050mm

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