Essential details
Shipping:Express Delivery
Specification Number:TS210
Product Introduction
| Desktop Vacuum Soldering Oven | TS110 | TS210 | ||
| 1效焊接面积 | 1. Soldering area | 110mm×110mm | 210mm×210mm | |
| 2、温度范围 | 2. Temperature range | Max 400℃ | Max 450℃ | |
| 3、真空度 | 3. Vacuum | ≤5Pa with mechnical pump, 10-3Pa with molecular pump | ≤1Pa with mechnical pump, 10-3Pa with molecular pump | |
| 4、温度均匀度 | 4. Temperature uniformity | ≤± 2% | ≤± 2% | |
| 5、升温斜率 | 5. Heating rate | ≤120℃/Min | 60-120K/min | |
| 6、降温斜率 | 6. Cooling rate | ≤60-120℃/Min | 60-120K/min | |
| 7、冷却方式 | 7. Cooling way | Water cooling + nitrogen cooling | Nitrogen cooling | |
| 8、加热板材质 | 8. Heating plate material | Silicon carbide coated Graphite plate | Alloy heating plate | |
| 9、设备重量 | 9. Weight | 44KG | 240KG | |
| 10、设备外形尺寸 | 10. Size: | 290x200x650mm(Main body） | 900*800*780mm 240KG | |
| 11、电源供应： | 11. Power supply | 220V 50Hz | 220V 25A | |