Essential details
Shipping:Express delivery
Specification Number:TS210
Product Introduction
| Desktop Vacuum Soldering Oven | TS110 | TS210 | ||
| 1. Soldering area | 1. Soldering area | 110mm×110mm | 210mm×210mm | |
| 2. Temperature range | 2. Temperature range | Max 400℃ | Max 450℃ | |
| 3. Vacuum | 3. Vacuum | ≤5Pa with mechanical pump, 10-3Pa with molecular pump | ≤1Pa with mechanical pump, 10-3Pa with molecular pump | |
| 4. Temperature uniformity | 4. Temperature uniformity | ≤± 2% | ≤± 2% | |
| 5. Heating rate | 5. Heating rate | ≤120℃/Min | 60-120K/min | |
| 6. Cooling rate | 6. Cooling rate | ≤60-120℃/Min | 60-120K/min | |
| 7. Cooling way | 7. Cooling way | Water cooling + nitrogen cooling | Nitrogen cooling | |
| 8. Heating plate material | 8. Heating plate material | Silicon carbide coated Graphite plate | Alloy heating plate | |
| 9. Equipment weight | 9. Weight | 44KG | 240KG | |
| 10. Equipment overall dimensions | 10. Size: | 290x200x650mm (Main body) | 900*800*780mm 240KG | |
| 11. Power supply: | 11. Power supply | 220V 50Hz | 220V 25A | |