Essential details
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Product Introduction
| 1 Effective Soldering Area | 1. Soldering Area | 200mm×200mm | |
| 2. Temperature Range | 2. Temperature Range | 450℃, 650℃ is optional | |
| 3. Vacuum Degree | 3. Vacuum | 1 Pa with mechanical pump, 10-3 Pa with molecular pump | |
| 4. Temperature Uniformity | 4. Temperature Uniformity | ±2% | |
| 5. Heating Slope | 5. Heating Rate | 60-180K/min | |
| 6. Cooling Slope | 6. Cooling Rate | 60-300K/min | |
| 7. Cooling Method | 7. Cooling Method | Nitrogen Cooling | |
| 8. Heating Plate Material | 8. Heating Plate Material | Metal Alloy | |
| 9. Equipment Weight | 9. Weight | 240KG | |
| 10. Equipment Outline Dimensions | 10. Size: | 800*900*1650mm | |
| 11. Power Supply: | 11. Power Supply | 220V 25A |