High-Precision Die Bonder — DB100A
High-Precision Die Bonder — DB100A
High-Precision Die Bonder — DB100A
High-Precision Die Bonder — DB100A
High-Precision Die Bonder — DB100A
High-Precision Die Bonder — DB100A
High-Precision Die Bonder — DB100A
High-Precision Die Bonder — DB100A
High-Precision Die Bonder — DB100A
High-Precision Die Bonder — DB100A
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Product Introduction
 
DB100A
1. Mount Chip Size 0.2mm*0.2mm-20mm*20mm (max 50*50mm is optional)
1. Mount Accuracy ±3um
2. Feeding Method 2-inch waffle box*2 
3. Working Area 150mm*150mm
4. Nozzle Pressure Max 200N, Min 2N 
5. X Y Z Axis Resolution 0.1um 
6. R Axis Angle 360°
7. Configuration Bonding, glue dispensing, UV curing, flip chip are optional
8. Feeding Way Manual
9. Power Supply 220v, 50Hz
10. Weight 430kg
11. Size 800 * 1000 * 1250mm 

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