High-Precision Die Bonder — DB100A
High-Precision Die Bonder — DB100A
High-Precision Die Bonder — DB100A
High-Precision Die Bonder — DB100A
High-Precision Die Bonder — DB100A
High-Precision Die Bonder — DB100A
High-Precision Die Bonder — DB100A
High-Precision Die Bonder — DB100A
High-Precision Die Bonder — DB100A
High-Precision Die Bonder — DB100A
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Product Introduction
 
DB100A
1. Mount chip size 0.2mm*0.2mm-20mm*20mm (max 50*50mm is optional)
1. Mount accuracy ±3um
2. Feeding method 2-inch waffle box*2 
3. Working area 150mm*150mm
4. Nozzle pressure Max 200N,Min 2N 
5.X Y Z axis resolution 0.1um 
6.R axis angle 360°
7. Configuration Bonding, glue dispensing, UV curing, flip chip are optional
8. Feeding way Manual
9. Power supply 220v,50Hz
10. Weight 430kg
11. Size 800 * 1000 * 1250mm 

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