| 1效焊接面积 | 1. Soldering area | 300mm×300mm | |
| 2、温度范围 | 2. Temperature range | Max 600℃ | |
| 3、真空度 | 3. Vacuum | 0.3Pa with mechnical pump, 10-3Pa with molecular pump | |
| 4、温度均匀度 | 4. Temperature uniformity | ±1% | |
| 5、升温斜率 | 5. Heating rate | ≥150℃/min | |
| 6、降温斜率 | 6. Cooling rate | ≥200℃/min | |
| 7、冷却方式 | 7. Cooling way | Water cooling + nitrogen cooling | |
| 8、加热板材质 | 8. Heating plate material | Silicon carbide coated Graphite plate | |
| 9、设备重量 | 9. Weight | 320KG | |
| 10、设备外形尺寸 | 10. Size | 900*1100*1300mm | |
| 11、电源供应: | 11. Power supply | 380V,25-50A |



