Wafer Bonder — TORCH510
Wafer Bonder — TORCH510
Wafer Bonder — TORCH510
Wafer Bonder — TORCH510
Wafer Bonder — TORCH510
Wafer Bonder — TORCH510
Wafer Bonder — TORCH510
Wafer Bonder — TORCH510
Wafer Bonder — TORCH510
Wafer Bonder — TORCH510
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Essential details
Shipping:Express Delivery
Product Introduction
1.Bonding area2-6inch
2.Mechanical pressure10T(56T, 100T are optional)
3.Bonding force2inch: max 50Mpa, 3inch max 22Mpa, 4inch max 12Mpa,5inch max 8Mpa,  6inch max 5.5Mpa
4.Vacuum3Pa,working vacuum 10-200Pa,molecular pump 10-4Pa
5.Max temperature320℃
6.Temperature uniformity≤±1%
7.Heating rate20-60℃/min
8.Cooling rate10-30℃/min
9. Cooling wayWater cooling + nitrogen cooling
10.Post-Sintering Shear Strength25-35Mpa
11.Feeding wayManual
12.Voltage380V, 25-50A
13.Size1000*80*2050mm

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