Essential details
Shipping:Express Delivery
Product Introduction
| 1.Substrate size/BH size | 300 mm*300 mm 50mm*50mm | |
| 2.Mounting precision | ≤±2um | |
| 3.Stage heating temperature | ≥200℃, ±5% or ±10℃ | |
| 4. Stage vacuum adsorption | maximum 92kPa, can be adjustable | |
| 5. Stage Orthopedic ability | Achieve 300*300 rectangle，thickness 0.3~3mm Correction of rectangular substrates | |
| 6. BH heating temperature | ≥350℃, ±5% or ±10℃ | |
| 7.BH heating ratio | ≥100℃ | |
| 8. Bonding pressure | 1~500N, step≤1N | |
| 9. BH flatness | <5 μm (Hot state to be measured | |
| 10. Atmosphere | N2: Residual oxygen ≤ 200ppm | |
| 11. Die loading method | 12 '' Wafer Manual feeding | |
| 12. Size | 2400mm*1500mm*2000mm | |
| 13. Power supply | 220V/50Hz,8KW | |
| 14. Cooling water | Yes |